Methodologies for Reliability Prediction of Electronic Component in Military Vehicles
DOI:
https://doi.org/10.3849/aimt.01276Keywords:
reliability, failure rate, electronic components, LEDAbstract
Reliability prediction is conducted in all phases of the product life cycle. The purpose of these predictions is to identify the potential weaknesses in design, evaluate the design feasibility, compare alternative designs, provide the model for reliability analysis, track reliability improvement, etc. Reliability of electronic component is predicted by using the statistical prediction methods (standards-based), statistical analysis of operation & maintenance data or performing reliability testing. The article describes statistical prediction methods such as MIL-HDBK-217, RIAC 217Plus, FIDES Guide 2009, which are widely used for predicting the reliability of electronic components. In addition, we have calculated and compared the failure rate of electronic components in military vehicles with these different methods.
References
LEE, S.W. and LEE, H.K. Reliability Prediction System Based on the Failure Rate Model for Electronic Components. Journal of Mechanical Science and Technology, 2008, vol. 22, no. 5, p. 957-964. https://doi.org/10.1007/s12206-008-0212-4.
VINTR, Z. and VINTR, M. Reliability Prediction for Components of Robotic Systems. Advances in Automation and Robotics, 2011, vol. 2, p. 463-470. https://doi.org/10.1007/978-3-642-25646-2_60.
SOUZA, F.A., PEREIRA, P.C.T., DE PAULA, H., BRAZ FILHO, J.C. and ROCHA, A.V. Motor drive systems reliability: Impact of the environment conditions on the electronic component failure rates. In 2014 IEEE Industry Application Society Annual Meeting, 2014, p. 1-8. https://doi.org/10.1109/IAS.2014.6978463
THADURI, A., VERMA, A.K. and KUMAR, U. Comparison of Reliability Prediction Methods Using Life Cycle Cost Analysis. In Proceedings of Reliability and Maintainability Symposium (RAMS) 2013. Orlando, 2013, p. 1-7. https://doi.org/10.1109/RAMS.2013.6517747.
MIL-HDBK-217F-N2. Reliability Prediction of Electronic Equipment. Washington: US Department of Defense, 1995, 80 p.
HELD, M. and FRITZ, K. Comparison and Evaluation of Newest Failure Rate Prediction Models: FIDES and RIAC 217Plus. Microelectronics Reliability, 2009, vol. 49, no. 9-11, p. 967-971. https://doi.org/10.1016/j.microrel.2009.07.031.
RIAC. Handbook of 217Plus Reliability Prediction Models. New York: Defense Technical Information Center, 2006, 182 p.
FIDES Guide. Reliability Methodology for Electronic Systems. FIDES Group, 2009, 465 p.
Telcordia SR-332 Issue 2. Reliability Prediction Procedure for Electronic Equipment. Telcordia, 2006.
IEC TR 62380. Reliability Data Handbook – Universal Model for Reliability Prediction of Electronics Components, PCBs and Equipment. IEC, 2004, 96 p.
Downloads
Published
License
Copyright (c) 2019 Advances in Military Technology
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
Authors who publish with this journal agree to the following terms:
1. Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
2. Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
3. Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work.
Users can use, reuse and build upon the material published in the journal for any purpose, even commercially.
How to Cite
